Syenta is architecting the future of AI computing through its revolutionary Localized Electrochemical Manufacturing (LEM) technology, which enables High-Resolution Interconnects -a new class of chip-to-chip connections that transcends traditional packaging to deliver wafer-level system integration at unprecedented density.

Why work with us

With Syenta’s interconnect technology the compute-memory interface is no longer the bottleneck for AI. Our interconnects are sub-micron; manufactured on large >10000 mm2 packages.